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IUTAM Symposium on Mesoscopic Dynamics of Fracture Process and Materials Strength

Proceeding of the IUTAM Symposium held in Osaka, Japan, 6¿11 July 2003
BookHardcover
Ranking86230inTechnik
CHF191.00

Description

This volume contains the papers presented at the IUT AM Symposium of "Mesoscopic Dynamics of Fracture Process and Materials Strength", held in July 2003, at the Hotel Osaka Sun Palace, Osaka, Japan. The Symposium was proposed in 2001, aiming at organizing concentrated discussions on current understanding of fracture process and inhomogeneous deformation governing the materials strength with emphasis on the mesoscopic dynamics associated with evolutional mechanical behaviour under micro/macro mutual interaction. The decision of the General Assembly of International Union of Theoretical and Applied Mechanics (IUT AM) to accept our proposal was well-timed and attracted attention. Driven by the development of new theoretical and computational techniques, various novel challenges to investigate the mesoscopic dynamics have been actively done recently, including large-scaled 3D atomistic simulations, discrete dislocation dynamics and other micro/mesoscopic computational analyses. The Symposium attracted sixty-six participants from eight countries, and forty two papers were presented. The presentations comprised a wide variety of fundamental subjects of physics, mechanical models, computational strategies as well as engineering applications. Among the subjects, discussed are (a) dislocation patterning, (b) crystal plasticity, (c) characteristic fracture of amorphous/nanocrystal, (d) nano-indentation, (e) ductile-brittle transition, (f) ab-initio calculation, (g) computational methodology for multi-scale analysis and others.
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ISBN/GTIN978-1-4020-2037-7
Product TypeBook
BindingHardcover
Publishing date26/05/2004
Edition2004
Series no.115
Pages484 pages
LanguageEnglish
SizeWidth 160 mm, Height 241 mm, Thickness 32 mm
Weight887 g
Article no.3322023
Publisher's article no.11257165
CatalogsBuchzentrum
Data source no.16416143
Product groupTechnik
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