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Emerging Electronic Devices, Circuits and Systems

Select Proceedings of EEDCS Workshop Held in Conjunction with ISDCS 2022
BookHardcover
Ranking26684inTechnik
CHF299.00

Description

The book constitutes peer-reviewed proceedings of a workshop on Emerging Electronics Devices, Circuits, and Systems (EEDCS) held in conjunction with International Symposium on Devices, Circuits, and Systems (ISDCS 2022). The book focuses on the recent development in devices, circuits, and systems. It also discusses innovations, trends, practical challenges, and solutions adopted in device design, modeling, fabrication, characterization, and their circuit implementation with pertinent system applications. It will be useful for researchers, developers, engineers, academicians, and students.
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Details

ISBN/GTIN978-981-99-0054-1
Product TypeBook
BindingHardcover
Publishing date01/05/2023
Edition2023
SeriesLecture Notes in Electrical Engineering
Series no.1004
Pages484 pages
LanguageEnglish
SizeWidth 160 mm, Height 241 mm, Thickness 30 mm
Weight975 g
Article no.22039273
CatalogsBuchzentrum
Data source no.43707532
Product groupTechnik
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Author

Chandan Giri received B.Tech degree in Computer Science & Engineering from Calcutta University, Kolkata, India in 2000 and subsequently Masters of Engineering (M.E) in Computer Science & Engineering from Jadavpur University, Kolkata, India in 2002 and the Ph.D degree from the Department of Electronics & Electrical Communication Engineering, Indian Institute of Technology, Kharagpur in 2008. He is currently an Associate Professor in the Department of Information Technology, Indian Institute of Engineering Science and Technology, Shibpur, India. His research interests are wireless sensor networks, testing and design-for-testability of integrated circuits (especially 3D and multicore chips), microfluidic biochip design, and testing
Takahiro Lizuka received Ph.D. degree from Hiroshima University, Higashi-Hiroshima, Japan, in 2013. From 1986 to 2012, he was with NEC Corporation, NEC Electronics Corporation, and Renesas Electronics Corporation, where he was involved in carrier transport modeling for TCAD and led a SPICE modeling team during 2003-2012. During these years, he was also with the Semiconductor Technology Academic Research Center, Yokohama, Japan, where he was involved with the development of the HiSIM family models interacting with Hiroshima University as Visiting Researcher. Since 2012, he has been with the HiSIM Research Center, at Hiroshima University, where he is involved in compact modeling, including maintaining, improving, and developing the HiSIM family models. Dr. Iizuka is a Member of IEEE, IEICE (The Institute of Electronics, Information and Communication Engineers, Japan), and JSAP (The Japan Society of Applied Physics), respectively.

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